Test boards

Tailor-made designs for

Test interfaces

id3 technologies offers design and manufacturing test board services for semiconductor components. Our designs are tailored to meet the specific needs of each application (high frequency, high temperature, low leakage, parametric test, parallel multi-DUT…). With more than 20 years of experience in the design of electronic circuits (analog, digital / mixed high speed circuit, RF circuits ..), we can support you from the technical specifications and perform design stages: Architecture, component selection, schematics, routing and manufacturing.

Test interface
\

Probe Cards

\

Load Boards

\

Evaluation Boards

\

Adapter Cards

\

Burn-in Boards

Our expertise

In order to reproduce as closely as possible the performance of the DUT during test sequences, we apply to our designs the strongest design rules to reduce electromagnetic interferences and preserve the integrity of the signal.

test board
Techncial skills
  • High speed digital circuit, analog or RF,
  • Multilayer PCBs (+30 layers),
  • CMS, through-hole or mixt technologies,
  • Impedance control, crosstalk & EMI,
  • PCB stack-up optimization,
  • Routing of differential pairs,
  • Blind & buried vias, micro-vias, vias-in-pad.
Probe card

Probe card

Load board

Load board

Other features

Test socket

Test socket

FPGA development

FPGA development

 PCB & EM simulation

PCB & EM simulation

Vous souhaitez en savoir plus ?

N'hésitez pas à nous contacter pour plus d'information.