Electronic study & diagrams
We design your electronic cards.
From your needs or technical specifications, we do the study of your electronic cards or embedded systems: specifications, feasibility study, definition of architectures, components selection, electronic schematics… You will benefit from the experience of our team of engineers in the design of electronic products.
- Digital electronics (MCU, FPGA, CPLD),
- Analog electronics (capteurs, filtres…),
- Wireless (RFID, ZigBEE, Lora, Bluetooth, Wifi…)
- Networks (USB, Can, Ethernet IP…).
Electronic CAD – Printed circuit board routing (PCB)
We do the electronic CAD of the circuit board.
Our design office has an electronic CAD service for the PCB routing of electronic boards. In collaboration with our electronics engineers, CAD technicians integrate all the normative and technical requirements included in the specifications (written by the customer or by our teams). We follow the recommendations of IPC standards for the electronic design of electronic cards with the integration of thermal and dimensional constraints, signal integrity, industrialization constraints or EMC needs.
- Analog, digital, mixed and HF circuit,
- Adaptation and impedance control,
- BGA routing (pitch <400μ), DDR, Flex (pitch <80μ),
- Complex stack-up, up to 30 layers,
- Compliance with IPC standards.
Electronic card manufacturing
Quality manufacturing and local service.
For the production of our electronic cards, we have selected a panel of partners based on their technological expertise, the means of production and the quality approach. Thanks to this professional network, we can meet the various technical, quantitative, normative and economic needs of our customers. To offer quality services, our research department favors French subcontractors who offer local services and flexibility. We deliver the manufacturing file as well as the source files and softwares of the electronic card.
- Single / Double Sided / Multi Layers,
- Flex / flex-rigid,
- Laser micro-vias, blind and buried holes,
- High temperature and RF materials,
- HAL, chemical silver, nickel-gold chemical …
Achievements in electronic design
22-layers printed circuit board,
BGA pitch of 0.4, 4 + 4 laser levels,
HTG material, Class 8, NiAu chemical,
Matched impedance tracks same length.
Mechanical design of the molded box,
6 layers card, FR4 Tg130,
Portable medical device on battery.
Assembly 2xBGA 512-0.5,
MC6, class 9.
FR4 material Tg180 + KAPTON 100μ,
Thickness 8 / 10th, CU 17/35 μm,
Other services of our design office
Need a pre-study or an estimate ?
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